It is important to consider the different deposition processes between different film materials, 

the implementation of different sputtering techniques (DC,intermediate frequency, 

RF, pulse,reactive sputtering and their combination technology or the application of new technologies),

the adjustment of different process parameters of the same technology 

(power, air pressure, deposition mode,etc.), pretreatment (cleaning, preheating,etc.), 

post-treatment (heat treatment, etc.).